Wafer Dicing Services
In-House Silicon/Semiconductor Wafer Dicing Services
Also called wafer sawing, wafer cutting, and die singulation, wafer dicing is a precision process where semiconductor wafers are cut into small square or rectangular “chips” or “die” that are critical for the quality of all remaining post-fab processes and end-use performances. Syagrus Systems is known for our high quality, ISO 9001:2015 certified silicon wafer dicing standards. Our fully automated silicon wafer dicing capabilities are designed to meet and exceed your specifications. We utilize double pass cutting to yield superior dies with improved accuracy compared to our competitors. Additionally, all dies are subject to magnification die visual inspection to ensure your wafer is at peak optimization.
We have the expertise, capabilities, and equipment to deliver precision wafer dicing services. No job is too big or too small. Request a quote to get started, call 651-209-6515 today to speak directly with a highly trained and knowledgeable representative.
Improve Production with Precision Die Singulation Services
Wafer dicing is measured by the yield and quality of the final dies. Effective wafer dicing can improve production output by providing final dies with enhanced quality. We utilize advanced equipment to mount wafers on dicing tape to secure the wafer to a metal frame. Our skilled engineers then cut the wafer with our in-house, high-speed saw to create singular dies. Dies are then inspected and removed safely from the frame via pick and place to prevent unnecessary damage or die flaws.
Syagrus Systems facilitates high-volume and low-volume die cutting orders. Our multi-die cutting system allows us to create multiple quality dies at once. This allows us to provide quick turnaround times on the dies you need. We can also perform dicing operations on previously singular multi-die reticles and partial wafers.
Precision Silicon Wafer Dicing Features
All wafer dicing is performed in a Class 10K cleanroom environment. Same-day cycle time available upon request for fast turnaround on wafer dicing operations. Specific wafer dicing features include but are not limited to:
- 0.25” (6.35mm) to 12” (300mm) flexible wafer dicing workspace capable of sawing multi-die reticles
- High-precision wafer dicing for singulated devices as small as 0.006” (0.2mm) and wafers as thin as 0.0008” (0.02mm)
- Bumped and non-bumped silicon wafer dicing
- Surfactant available
Additional Wafer Processing Services
Syagrus Systems is equipped to offer full-service solutions. In addition to die singulation, and depending on your production and goals, we may recommend:
- Wafer Backgrinding reduces wafer thickness to produce ultra-thin wafers for stacking and high-density packaging in compact electronic devices.
- Wafer Polishing removes between 5 and 10 microns of silicon from the backside of a wafer to dramatically reduce the peaks and valley microdamage left behind by other silicon wafer processes.
- Or a variety of other wafer services including Die Visual Inspection, Die Sorting, Backside Metal & Sputtering Deposition & More.
Considerations for Choosing Wafer Sawing Processes
Material hardness/brittleness, thermal sensitivity, desired chip size/geometry, accuracy requirements and production costs are just a few considerations to be made prior to choosing a wafer dicing process to meet your application needs. Each of our high-precision processes is customizable to match your unique needs.
Contact us a Syagrus Systems expert and let us determine how to best support your facility with high-quality die pick-and-place equipment.
Wafer Dicing For Semiconductors & Additional Industries
Industrial production lines—including leading semiconductor, military, and medical device manufacturers—require a trusted partner to deliver defect-free die for automated assembly operations. While our precision silicon wafer dicing services are most often utilized by semiconductor and integrated circuit manufacturers, our products and services are prepared to meet the needs of most industries:
- Military and Aerospace
- Medical Electronics
- OEMs
- RFID Communications
- Telecommunications and Commercial Electronics
- Scientific Universities and Research Laboratories
Contact Syagrus Systems for Precision Silicon Wafer Dicing & Processing
Syagrus Systems provides world-class post-fab processing for silicon wafers and semiconductor wafers. As an ISO 9001:2015 certified wafer dicing manufacturer, we are dedicated to continuously improving our services to give you a competitive edge.
Request a quote to begin your wafer cutting order. Contact us for more information.
