Wafer Processing for Military & Aerospace Applications
Electronic assemblies used in military and aerospace jobs have no room for error as the most minor flaw can have major consequences. All components, including silicon wafers and die, must meet strict mil-spec guidelines, aerospace quality regulations, and other uncompromising requirements. At Syagrus Systems, we have experience with wafer processing for military and aerospace applications, and we have worked with manufacturers creating:
- Wearable electronics
- Surveillance systems, weapon assemblies, and more
- Airplane and spacecraft controls, sensors, and systems
- Drones and UAV assemblies
- And many other high-technology applications
Syagrus Systems is your source for world-class post-fab wafer processing for military and aerospace applications. Contact us to learn how we can support your high-technology and precision operations through dependable wafer services.
Precision Post-Fab Wafer Processing Services
Manufacturing and processing silicon wafers for aerospace and military assemblies requires extreme precision, accuracy, and repeatability. Our services have been developed to meet these industries' uncompromising regulations and federal guidelines. Depending on your planned application, we may recommend:
- Silicon Wafer Bonding
- Wafer Backgrinding
- Silicon Wafer Dicing
- Wafer Polishing
- Wafer and Die Visual Inspections
- And many other precision services
We have extensive experience processing wafers for military and aerospace applications, and we are ready to work with you to identify your best service. Call 651-209-6515 to speak with a representative directly about your project’s parameters.
MEMS Device Wafer Thinning Services
Micro-electromechanical systems, or MEMS, are microscopic devices used in many electronics and systems with moving parts. As they are comprised of components that range from 1 to 100 micrometers, ultrathin silicon wafers are critical for successful operations. To meet the exacting demands of MEMS devices for military and aerospace applications, our capabilities include:
- Ability to target thicknesses of 0.025mm (0.001”)
- Thickness variances under 5 microns
- 3M™ Wafer Support System to support ultrathin wafers
- And much more
Wafer Dicing for RF Chips
RF chips, or radio frequency chips, are responsible for sending and receiving information in electronic assemblies across industries. They control RF transceivers, frequency synthesis, and power amplification. In order to maintain dependable operations in critical military and aerospace applications, all die used in RF chips and related assemblies must meet strict guidelines for precision operations. Our wafer dicing services for RF chips offer:
- Same-day cycle times
- 0.25” (6.35mm) to 12” (300mm) flexible wafer dicing workspace capable of sawing multi-die reticles
- Ability to meet demands for devices as small as 0.006” (0.2mm) and wafers as thin as 0.0008” (0.02mm)
- And other capabilities
High-Quality Wafer Processing for Military & Aerospace Applications
Syagrus Systems strives to ensure complete quality at all processing stages. From ongoing and prompt communications through high-quality services, our expertise is at your disposal from initial quotes to final delivery. Steps of our quality assurance protocols include:
- Processing wafers in a Class 10K cleanroom environment
- Electro Static Discharge (ESD) program, offering internal auditing, daily testing, and more
- ISO 9001:2015 certified
- Highly trained operators with many years of experience
- Incorporation of your in-house and industry-specific quality requirements
Contact Syagrus Systems Today
Contact us today to learn more about how our wafer processing for military and aerospace applications can support your goals. Request a quote to begin your order.
