In-House Laser Dicing Services for Silicon Wafers
Laser dicing uses a non-contact laser to precisely separate silicon wafers into die. At Syagrus Systems, we perform laser dicing to ISO 9001:2015 standards, reducing manufacturing waste and lowering production costs. Our technique delivers accurate cuts without edge flaking, ideal for the precision manufacturing of thin, fragile wafers in microelectronics and other industries. Every die undergoes magnified visual inspection to ensure optimal wafer quality.
Syagrus Systems has the expertise, capabilities, and equipment to deliver precision wafer dicing services. Request a quote to get started or call 651-209-6515 today to speak directly with a highly trained and knowledgeable representative.
Laser Dicing Advantages
Syagrus Systems’ laser dicing processes create precision die cuts that can increase the number of dies generated from a single wafer. Laser dicing is more efficient than traditional blade dicing and can produce dies without placing stress on sensitive wafers. Additional advantages include:
- Accurate, Closely Focused Die Cuts
- Faster Cutting
- Smaller Kerf Width
- Ensured Die Quality
- Reduced Manufacturing Waste
- Reduced Component Distortions
The risk of chipping and cracking is also greatly reduced with laser dicing because it is a non-contact dicing technique. This is advantageous for dicing stress-sensitive wafers with densely packed features. Laser dicing can separate chips with minimal space between them to create fewer consumables. Additionally, laser dicing can generate die at speeds almost 10 times faster than standard blade dicing.
Things to Consider When Picking a Dicing Method
Material hardness/brittleness, thermal sensitivity, desired chip size/geometry, accuracy requirements and production costs are just a few considerations to be made before undergoing laser dicing processes. Contact a Syagrus Systems expert so we can help determine the support your facility needs.
Wafer Dicing For Semiconductors & Additional Industries
Industrial production lines—including leading semiconductor, military, and medical device manufacturers—require a trusted partner to deliver defect-free dies for automated assembly operations. While our precision silicon laser dicing services are most often utilized by semiconductor and integrated circuit manufacturers, our products and services are prepared to meet the needs of most industries:
- Military and Aerospace
- Medical Electronics
- OEMs
- RFID Communications
- Telecommunications and Commercial Electronics
- Scientific Universities and Research Laboratories
Additional Wafer Processing Services
Syagrus Systems is equipped to offer full-service solutions. In addition to die singulation, and depending on your production and goals, we may recommend:
- Wafer Backgrinding reduces wafer thickness to produce ultra-thin wafers for stacking and high-density packaging in compact electronic devices.
- Wafer Polishing removes between 5 and 10 microns of silicon from the backside of a wafer to dramatically reduce the peaks and valley microdamage left behind by other silicon wafer processes.
- Or a variety of other wafer services including Die Visual Inspection, Die Sorting, Backside Metal & Sputtering Deposition & More.
Contact Syagrus Systems to Discuss Your Silicon Laser Dicing Needs
Contact us to discuss our post-fab back-end silicon laser dicing services. Request a quote to begin your process. An expert representative will be in touch as soon as possible.
